1.1”This practice relates to the radiographic examination of electronic devices for internal discontinuities, extraneous material, missing components, crimped or broken wires, and defective solder joints in cavities, in the encapsulating materials, or the boards. Requirements expressed in this practice are intended to control the quality and repeatability of the radiographic images and are not intended for controlling the acceptability or quality of the electronic devices imaged.

Product Details

Published:

11/01/2021

Number of Pages:

5

File Size:

1 file , 120 KB

Redline File Size:

2 files , 270 KB