Description

This specification and its supplementary detail specifications cover boron filaments in the form of tape impregnated with epoxy resin, the resin to be supplied in a “B” stage condition. Primarily for fabricating high-strength and high-modulus composite parts, using either hand-layup or automated-tape-layup.

Product Details

Published:

04/01/2001

File Size:

1 file , 97 KB