Description

This specification covers the requirements for electrodeposition copper.

This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces on which carburizing is neither required nor permitted, to prevent decarburization, to enhance solderability, or to provide a source of copper for furnace brazing, but usage is not limited to such applications.

Product Details

Published:

02/18/2011

File Size:

1 file , 44 KB