Description

Specifies the data format for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. It also gives definitions of all parameters used according to the principles and methods of IEC 61360.

Cross References: ES 59008-1*ES 59008-2*ES 59008-3*ES 59008-4-1*ES 59008-4-3*ES 59008-4-4*IEC 61360*ISO 8601:1988*ANSI X3.30*ISO 6093:1985*

Product Details

Published:

12/15/1999

ISBN(s):

0580357570

Number of Pages:

42

File Size:

1 file , 870 KB

Product Code(s):

19977585, 19977585, 19977585