SAE

Adhesive Compound, Epoxy Medium Temperature Application
standard by SAE International, 10/01/1995

Adhesive Compound, Epoxy Resing High Temperature Application
standard by SAE International, 08/14/2014

ADHESIVE, MODIFIED EPOXY Moderate Heat Resistant, 120 °C (250 °F) Curing, Film Type (Noncurrent: Jan 1993)
standard by SAE International, 01/01/1993

Aerodynamic Smoothing Compound, Flexible ¿¿¿55¿¿ to +130¿¿C (¿¿¿65¿¿ to +270¿¿F) (Stabilized: Jan 2012)
standard by SAE International, 01/17/2012

Adhesive Film, Epoxy-Base For High Durability Structural Adhesive Bonding
standard by SAE International, 08/14/2014

Adhesive Film, Epoxy-Base, High Durability For 95 ¿¿C (200 ¿¿F) Service
standard by SAE International, 08/14/2014

Adhesive Film, Epoxy-Base, High Durability For 215 ¿¿C (420 ¿¿F) Service
standard by SAE International, 08/15/2014

Aerodynamic Fairing Compound, -55 to +85\mDC (-65 to +185\mDF) ( Noncurrent: Jul 1991 Feb 2004 )
standard by SAE International, 07/01/1983

Aerodynamic Fairing Compound ¿¿¿55¿¿ to +85¿¿C (¿¿¿65¿¿ to +185¿¿F) (Stabilized: Jan 2012)
standard by SAE International, 01/17/2012

ADHESIVE FILM, HOT-MELT, ADDITION-TYPE POLYIMIDE For Foam Sandwich Structure, −55 to +230 °C (−65 to +450 °F) (Noncurrent: Jan 1993)
standard by SAE International, 01/01/1993

Adhesive Film, Hot-Melt, Addition-Type Polyimide For Foam Sandwich Structure, ¿¿¿55 to +230 ¿¿C (¿¿¿65 to +450 ¿¿F) (Stabilized: Nov 2016)
standard by SAE International, 11/10/2016

RESIN SYSTEM, EPOXY, CARBON MICROBALLOON FILLED 135 ¿¿C (275 ¿¿F) Cure (Noncurrent: Jan 1993)
standard by SAE International, 01/01/1993