Description

Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. Also gives recommendations for general industry good practice in its use. To be read in conjunction with PD ES 59008-1

Cross References: ES 59008-1*ES 59008-2*ES 59008-4*ES 59008-5*ES 59008-6-1*ES 59008-6-2*IEC 60191 *IEC 61360-1:1995*EIA/JESD30-B*EIA/JEP95*BS 3934*

Product Details

Published:

12/15/1999

ISBN(s):

0580357597

Number of Pages:

14

File Size:

1 file , 390 KB

Product Code(s):

19978933, 19978933, 19978933