Description
Specifies requirements for the exchange of data pertaining to bare semiconductor die, with or without connection structures and minimally-packaged semiconductor die. Specifies the use of models to simulate the electrical behaviour and the correct functionality of electronic systems. Also gives recommendations for general industry good practice in its use.
Cross References:
IEC 61691-1
IEC 61691-2
IEC 61691-3-1
IEC 62014-1
PNW 93-60
EIA/JESD 49
IEEE 1029.1
IEEE 1076
IEEE/ANSI 1149.1
IEEE 1364
ES 59008-1
ES 59008-2
ES 59008-3
ISO 8601:1998
Replaced by BS EN 62258-5:2006 but remains current.
All current amendments available at time of purchase are included with the purchase of this document.
Product Details
- Published:
- 03/15/2000
- ISBN(s):
- 0580341852
- Number of Pages:
- 14
- File Size:
- 1 file , 740 KB
- Product Code(s):
- 19978909, 19978909, 19978909
