Description

This part of IEC 60286 contains information about the introduction of an innovative bulk blisterpacking system for miniaturized components, for example chip type components of size 1005(metric) and smaller. It includes a proposal for standardization of the interface between thepackaging and automatic assembly systems and requirements to the properties of thepackaging.

Cross References:
IEC 60286-3:2019
IEC 61340-5-3:2015
IEC 62090:2017
IEC 61340-5-1:2016

All current amendments available at time of purchase are included with the purchase of this document.

Product Details

Published:

10/29/2019

ISBN(s):

9780539032666

Number of Pages:

16

File Size:

1 file , 1.9 MB

Product Code(s):

30388258, 30388258, 30388258