Description

This specification covers a room-temperature-vulcanizing, elastomeric silicone compound in the form or a base compound and a catalyst.

This compound has been used typically for potting and encapsulating electronic products for use at temperatures from -50 to +260 degrees C (-58 to +500 degrees F) where resistance to reversion is not required, but usage is not limited to such applications.

Product Details

Published:

02/01/1995

File Size:

1 file , 27 KB